一般(ban)说来，是(shi)根据设(she)计要(yao)求(qiu)(qiu)进行测(ce)(ce)(ce)试(shi)，不(bu)(bu)(bu)符合(he)设(she)计要(yao)求(qiu)(qiu)的(de)(de)(de)(de)(de)(de)就(jiu)是(shi)不(bu)(bu)(bu)合(he)格。而设(she)计要(yao)求(qiu)(qiu)，因(yin)产品不(bu)(bu)(bu)同而各不(bu)(bu)(bu)相同，有的(de)(de)(de)(de)(de)(de)IC需(xu)要(yao)测(ce)(ce)(ce)试(shi)大量的(de)(de)(de)(de)(de)(de)参数，有的(de)(de)(de)(de)(de)(de)则只(zhi)需(xu)要(yao)测(ce)(ce)(ce)试(shi)很(hen)少(shao)的(de)(de)(de)(de)(de)(de)参数。事实上，一个具体(ti)的(de)(de)(de)(de)(de)(de)IC，并不(bu)(bu)(bu)一定要(yao)经历(li)(li)上面(mian)提(ti)到的(de)(de)(de)(de)(de)(de)全部测(ce)(ce)(ce)试(shi)，而经历(li)(li)多(duo)(duo)道(dao)测(ce)(ce)(ce)试(shi)工序的(de)(de)(de)(de)(de)(de)IC，具体(ti)在哪(na)个工序测(ce)(ce)(ce)试(shi)哪(na)些参数，也是(shi)有很(hen)多(duo)(duo)种变化的(de)(de)(de)(de)(de)(de)，这是(shi)一个复杂(za)的(de)(de)(de)(de)(de)(de)系(xi)统工程(cheng)。例如对(dui)于(yu)芯(xin)片(pian)面(mian)积(ji)大、良(liang)率(lv)高、封装成本低(di)的(de)(de)(de)(de)(de)(de)芯(xin)片(pian)，通常可以不(bu)(bu)(bu)进行wafertest，而芯(xin)片(pian)面(mian)积(ji)小、良(liang)率(lv)低(di)、封装成本高的(de)(de)(de)(de)(de)(de)芯(xin)片(pian)，Z好(hao)将很(hen)多(duo)(duo)测(ce)(ce)(ce)试(shi)放(fang)在wafertest环(huan)(huan)节(jie)(jie)，及早发现(xian)不(bu)(bu)(bu)良(liang)品，避免不(bu)(bu)(bu)良(liang)品混入(ru)封装环(huan)(huan)节(jie)(jie)，无谓(wei)地增加封装成本。芯(xin)片(pian)测(ce)(ce)(ce)试(shi)机(ji)是(shi)电路设(she)计和制造的(de)(de)(de)(de)(de)(de)重要(yao)工具。广(guang)东芯(xin)片(pian)测(ce)(ce)(ce)试(shi)机(ji)

当(dang)自(zi)(zi)动(dong)(dong)上料(liao)(liao)装置(zhi)(zhi)40的(de)位(wei)于较上方的(de)tray盘(pan)中的(de)50个(ge)芯(xin)(xin)片(pian)(pian)全部完成测(ce)(ce)试(shi)后(hou)，50个(ge)芯(xin)(xin)片(pian)(pian)中出现1个(ge)或(huo)2个(ge)不(bu)合(he)(he)格(ge)品时，此时自(zi)(zi)动(dong)(dong)下(xia)料(liao)(liao)装置(zhi)(zhi)50的(de)tray盘(pan)没(mei)有放(fang)满50个(ge)芯(xin)(xin)片(pian)(pian)。则此时该测(ce)(ce)试(shi)方法(fa)还包括以下(xia)步骤：将(jiang)(jiang)自(zi)(zi)动(dong)(dong)上料(liao)(liao)装置(zhi)(zhi)40的(de)空(kong)的(de)tray盘(pan)移(yi)载(zai)至(zhi)中转(zhuan)装置(zhi)(zhi)60，然(ran)后(hou)从自(zi)(zi)动(dong)(dong)上料(liao)(liao)装置(zhi)(zhi)40的(de)下(xia)一个(ge)tray盘(pan)中吸(xi)取芯(xin)(xin)片(pian)(pian)进行测(ce)(ce)试(shi)，并将(jiang)(jiang)测(ce)(ce)试(shi)合(he)(he)格(ge)的(de)芯(xin)(xin)片(pian)(pian)放(fang)置(zhi)(zhi)到自(zi)(zi)动(dong)(dong)下(xia)料(liao)(liao)装置(zhi)(zhi)50，直(zhi)至(zhi)自(zi)(zi)动(dong)(dong)下(xia)料(liao)(liao)装置(zhi)(zhi)50的(de)tray盘(pan)中放(fang)满测(ce)(ce)试(shi)合(he)(he)格(ge)的(de)芯(xin)(xin)片(pian)(pian)，然(ran)后(hou)将(jiang)(jiang)中转(zhuan)装置(zhi)(zhi)60的(de)空(kong)的(de)tray盘(pan)移(yi)载(zai)至(zhi)自(zi)(zi)动(dong)(dong)下(xia)料(liao)(liao)装置(zhi)(zhi)50。广东芯(xin)(xin)片(pian)(pian)测(ce)(ce)试(shi)机芯(xin)(xin)片(pian)(pian)测(ce)(ce)试(shi)机可以检测(ce)(ce)芯(xin)(xin)片(pian)(pian)的(de)电学参数(shu)，包括电流和电压等(deng)。

芯(xin)(xin)片测试(shi)(shi)(shi)机是(shi)(shi)一种(zhong)专门用来检(jian)测芯(xin)(xin)片的(de)工具。它(ta)可(ke)以在生产中测试(shi)(shi)(shi)集成电(dian)(dian)(dian)路(lu)(lu)芯(xin)(xin)片的(de)功能和性能，来确保芯(xin)(xin)片质量(liang)符合设(she)(she)计要求。芯(xin)(xin)片测试(shi)(shi)(shi)机的(de)主(zhu)要作用是(shi)(shi)对(dui)芯(xin)(xin)片的(de)电(dian)(dian)(dian)学(xue)参数和逻辑特(te)性进(jin)行(xing)测量(liang)，然后按(an)照预定(ding)规则(ze)进(jin)行(xing)对(dui)比，从而(er)对(dui)测试(shi)(shi)(shi)结(jie)果(guo)进(jin)行(xing)评估。芯(xin)(xin)片测试(shi)(shi)(shi)机常见的(de)用途是(shi)(shi)测试(shi)(shi)(shi)运行(xing)纹理(li)阵(zhen)列器（FPGA）和应(ying)用特(te)定(ding)集成电(dian)(dian)(dian)路(lu)(lu)（ASIC）。FPGA作为可(ke)编程(cheng)芯(xin)(xin)片，通常是(shi)(shi)初步设(she)(she)计，测试(shi)(shi)(shi)和验证过(guo)程(cheng)中关(guan)键的(de)部分。ASIC则(ze)是(shi)(shi)根据设(she)(she)定(ding)的(de)电(dian)(dian)(dian)路(lu)(lu)、电(dian)(dian)(dian)子设(she)(she)备(bei)和/或存储器进(jin)行(xing)硬件(jian)配置的(de)特(te)定(ding)集成电(dian)(dian)(dian)路(lu)(lu)。

下(xia)面对本(ben)发明(ming)的(de)(de)(de)优(you)点或(huo)原理(li)进行(xing)说明(ming)：使用本(ben)发明(ming)的(de)(de)(de)芯(xin)片(pian)(pian)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)机进行(xing)芯(xin)片(pian)(pian)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)时，首先在自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)上料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)上放(fang)(fang)置(zhi)(zhi)(zhi)(zhi)多(duo)个tray盘(pan)(pan)(pan)，每(mei)一(yi)个tray盘(pan)(pan)(pan)上均放(fang)(fang)满或(huo)放(fang)(fang)置(zhi)(zhi)(zhi)(zhi)多(duo)个待(dai)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)芯(xin)片(pian)(pian)，同(tong)时在自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)下(xia)料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)和不良(liang)(liang)品(pin)(pin)放(fang)(fang)置(zhi)(zhi)(zhi)(zhi)台上分别放(fang)(fang)置(zhi)(zhi)(zhi)(zhi)空的(de)(de)(de)tray盘(pan)(pan)(pan)。测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)机启动(dong)(dong)(dong)(dong)后，由移载(zai)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)从自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)上料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)tray盘(pan)(pan)(pan)中吸取待(dai)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)芯(xin)片(pian)(pian)移载(zai)至(zhi)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)进行(xing)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)，芯(xin)片(pian)(pian)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)完成后，移载(zai)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)将测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)合格的(de)(de)(de)芯(xin)片(pian)(pian)移载(zai)至(zhi)自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)下(xia)料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)空tray盘(pan)(pan)(pan)中，将不良(liang)(liang)品(pin)(pin)移载(zai)至(zhi)不良(liang)(liang)品(pin)(pin)放(fang)(fang)置(zhi)(zhi)(zhi)(zhi)台的(de)(de)(de)空tray盘(pan)(pan)(pan)中放(fang)(fang)置(zhi)(zhi)(zhi)(zhi)。当自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)上料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)一(yi)个tray盘(pan)(pan)(pan)中的(de)(de)(de)芯(xin)片(pian)(pian)全部完成测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)，且自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)下(xia)料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)空tray盘(pan)(pan)(pan)中全部装(zhuang)(zhuang)(zhuang)满测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)后的(de)(de)(de)芯(xin)片(pian)(pian)后，移载(zai)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)将自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)上料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)空tray盘(pan)(pan)(pan)移载(zai)至(zhi)自(zi)(zi)(zi)(zi)动(dong)(dong)(dong)(dong)下(xia)料(liao)(liao)(liao)装(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)。本(ben)发明(ming)的(de)(de)(de)芯(xin)片(pian)(pian)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)机的(de)(de)(de)结构紧(jin)凑，体积较(jiao)小，占地面积只为一(yi)平米左右，可(ke)满足小批量的(de)(de)(de)芯(xin)片(pian)(pian)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)需求。芯(xin)片(pian)(pian)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)机还可(ke)以进行(xing)闩锁扫描(miao)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)和边缘(yuan)扫描(miao)测(ce)(ce)(ce)试(shi)(shi)(shi)(shi)。

自动(dong)(dong)上(shang)料(liao)(liao)机构(gou)42上(shang)料(liao)(liao)时，将(jiang)(jiang)放(fang)满待(dai)测(ce)(ce)芯(xin)(xin)片(pian)(pian)(pian)的(de)(de)多(duo)个tray盘(pan)(pan)(pan)(pan)上(shang)下(xia)叠(die)放(fang)在头(tou)一(yi)料(liao)(liao)仓41的(de)(de)第二移(yi)(yi)动(dong)(dong)底板47上(shang)，且(qie)位(wei)于(yu)较(jiao)上(shang)层的(de)(de)tray盘(pan)(pan)(pan)(pan)位(wei)于(yu)头(tou)一(yi)料(liao)(liao)仓41的(de)(de)开(kai)口部。移(yi)(yi)载装置20首先吸取位(wei)于(yu)较(jiao)上(shang)层的(de)(de)tray盘(pan)(pan)(pan)(pan)中的(de)(de)芯(xin)(xin)片(pian)(pian)(pian)进(jin)行(xing)测(ce)(ce)试(shi)，当位(wei)于(yu)较(jiao)上(shang)层的(de)(de)tray盘(pan)(pan)(pan)(pan)中的(de)(de)芯(xin)(xin)片(pian)(pian)(pian)测(ce)(ce)试(shi)完成(cheng)后(hou)，将(jiang)(jiang)空的(de)(de)tray盘(pan)(pan)(pan)(pan)移(yi)(yi)载至(zhi)自动(dong)(dong)下(xia)料(liao)(liao)机构(gou)52。然后(hou)伺(si)服电机43驱动(dong)(dong)滚(gun)珠丝杆(gan)45转动(dong)(dong)，滚(gun)珠丝杆(gan)45通过头(tou)一(yi)移(yi)(yi)动(dong)(dong)底板46带动(dong)(dong)第二移(yi)(yi)动(dong)(dong)底板47向上(shang)移(yi)(yi)动(dong)(dong)，带动(dong)(dong)位(wei)于(yu)下(xia)方的(de)(de)tray盘(pan)(pan)(pan)(pan)向上(shang)移(yi)(yi)动(dong)(dong)，直至(zhi)所有的(de)(de)tray盘(pan)(pan)(pan)(pan)中的(de)(de)芯(xin)(xin)片(pian)(pian)(pian)全部测(ce)(ce)试(shi)完成(cheng)。芯(xin)(xin)片(pian)(pian)(pian)测(ce)(ce)试(shi)机可以进(jin)行(xing)DC和AC测(ce)(ce)试(shi)，以检测(ce)(ce)芯(xin)(xin)片(pian)(pian)(pian)的(de)(de)电性能。江苏IC芯(xin)(xin)片(pian)(pian)(pian)测(ce)(ce)试(shi)机哪家好

芯片(pian)测试机是一种用于测试集成(cheng)电路的(de)机器。广东芯片(pian)测试机

Open/Short Test: 检查(cha)芯(xin)(xin)片(pian)引脚(jiao)中是否(fou)有(you)开路或短路。DC TEST: 验证(zheng)(zheng)器(qi)件直流电流和电压参(can)(can)数(shu)。Eflash TEST: 测试内嵌flash的(de)功(gong)能(neng)(neng)及(ji)性能(neng)(neng)，包含(han)读写(xie)擦(ca)除动作及(ji)功(gong)耗和速度等各种参(can)(can)数(shu)。Function TEST: 测试芯(xin)(xin)片(pian)的(de)逻辑功(gong)能(neng)(neng)。AC Test: 验证(zheng)(zheng)交流规格，包括交流输出信号(hao)的(de)质量(liang)和信号(hao)时序参(can)(can)数(shu)。Mixed Signal Test: 验证(zheng)(zheng)DUT数(shu)模(mo)混合(he)电路的(de)功(gong)能(neng)(neng)及(ji)性能(neng)(neng)参(can)(can)数(shu)。RF Test: 测试芯(xin)(xin)片(pian)里(li)面RF模(mo)块的(de)功(gong)能(neng)(neng)及(ji)性能(neng)(neng)参(can)(can)数(shu)。芯(xin)(xin)片(pian)测试设备(bei)(bei)原理说(shuo)(shuo)明，对于芯(xin)(xin)片(pian)行业(ye)来说(shuo)(shuo)，其生产成本是很高的(de)，因此，其芯(xin)(xin)片(pian)测试设备(bei)(bei)在(zai)一定程度上(shang)建议采用我(wo)们(men)(men)的(de)芯(xin)(xin)片(pian)测试设备(bei)(bei)来降低企业(ye)运行成本，所以，芯(xin)(xin)片(pian)测试设备(bei)(bei)的(de)运行原理我(wo)们(men)(men)也(ye)不(bu)得不(bu)了(le)解(jie)清楚。广东(dong)芯(xin)(xin)片(pian)测试机

本(ben)文来自海润达物联科技有限责任(ren)公司：//qfd1mz.cn/Article/07f12599867.html